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Lam Research Corporation Stock Price History

Lam Research Corporation EPS

EPSDividend / share
-0.60.72.03.24.5200920112013201520172019202120232025

Lam Research Corporation Dividend per Share

Forward Yield
0.28%
Annual Dividend
1.04 USD
Payout
19.09%
Frequency
Quarterly
Yrs of growth
11+
CAGR 5Y
82.06%
Status
Dividend Grower
0.00.30.50.81.1201420152016201720182019202020212022202320242025

Lam Research Corporation Dividend Yield

Lam Research Corporation Payout Ratio

0%9%18%26%35%201420152016201720182019202020212022202320242025

Lam Research Corporation Dividend Growth

1Y CAGR
3Y CAGR
5Y CAGR
10Y CAGR
20Y CAGR
13.95%
147.68%
82.06%
56.96%
โ€”
Compound annual growth rate of dividend per share
Yield vs sector
0.28%
avg Technology: 2.76%
Next ex-dividend (est.)
2026-09-16
last: 2026-06-17
Ex-DateAmount
2026-06-170.26 USD
2026-03-040.26 USD
2025-12-030.26 USD
2025-09-240.26 USD
2025-06-180.23 USD
2025-03-050.23 USD
2024-12-110.23 USD
2024-09-170.02 USD

Lam Research Corporation is a leading provider of semiconductor wafer fabrication equipment and related services. The company designs, manufactures, markets, refurbishes, and services tools used primarily in the fabrication of integrated circuits, with a strong focus on deposition and etch processes that build up and selectively remove material layers on silicon wafers. Its products are used mainly in front-end wafer processing to form transistors, capacitors, and interconnects, as well as in certain back-end wafer-level packaging applications. Lam Research serves major chipmakers worldwide, supporting production of both logic and memory devices, including DRAM and NAND. The company operates across key semiconductor manufacturing regions such as the United States, China, Korea, Taiwan, Japan, Europe, and Southeast Asia, providing equipment, process expertise, and ongoing customer support. Founded in 1980 and headquartered in Fremont, California, Lam Research today plays a central role in enabling advanced semiconductor manufacturing nodes that underpin computing, data center, mobile, and other high-performance electronic applications.